On May 16, 2024, Chongqing Lanshan Automotive Electronics Co., Ltd. (hereinafter referred to as "Lanshan Electronics") and Jifu Automotive Technology (Suzhou) Co., Ltd. (hereinafter referred to as "Jifu Automotive") signed a strategic cooperation agreement in Chongqing. Li Tao, General Manager of Lanshan Electronics, and Ni Bin, General Manager of Jifu Automobile, attended the signing ceremony as representatives of both parties.
At the signing ceremony, Li Tao, General Manager of Lanshan Electronics, and Ni Bin, General Manager of Jifu Automobile, officially signed a strategic cooperation agreement in the presence of representatives from both parties. Lanshan Electronics focuses on providing customers with high-performance and high reliability automotive chips, continuously launching highly competitive solutions that meet the needs of industrial customers. Jifu Automobile is committed to the development of automotive electronics related products, technology research and development, and service consulting, focusing on the development of automotive electronics underlying software (BSW) and application layer development (ASW) of automotive power domain systems. Lanshan Electronics and Jifu Automobile have a high degree of alignment in their value recognition of intelligent fields such as automotive grade chips and solutions. They look forward to taking strategic cooperation as an opportunity to work together and promote the implementation of cooperative projects.
Li Tao from Lanshan Electronics stated that the strategic cooperation between Lanshan Electronics and Jifu Automobile is not only a recognition of their respective strengths, but also a precise grasp of future industry trends. Both parties believe that through this cooperation, we can accelerate technological innovation, broaden market boundaries, and jointly usher in a new era of promoting domestically produced chips.
Ni Bin, General Manager of Jifu Automobile, stated that the successful signing of this strategic cooperation is a choice based on the shared vision and values of both parties. Working hand in hand is the key to success in a rapidly changing market environment. Through this cooperation, not only can it promote the rapid growth of both parties' businesses, but it can also inject new vitality into the development of the entire industry.
When the core is in agreement, no plan can be achieved. In the future, both parties will take this signing as an opportunity to lift the sail of mutual benefit and win-win cooperation, stabilize the helm of unity and cooperation, and cooperate sincerely in multiple dimensions such as technology sharing, market expansion, and product innovation. Together, we will explore industry chip opportunities, tackle industry chip challenges, promote industrial upgrading, and lead the trend of future development.
