• Qualification:Bachelor or above degree
    Work Address:Chongqing/Chengdu
    Salary:
    Update time:2025.08.20

    1. Responsible for the entire process of SOC/ASIC chips from netlist to tap out;

    2. Negotiate with front-end designers to solve problems encountered during the physical design process and optimize design solutions;

    3. Timely write various design documents and standardized materials to achieve resource and experience sharing.

    Learn more
  • Qualification:Bachelor or above degree
    Work Address:Chongqing/Chengdu
    Salary:
    Update time:2025.08.20

    Responsible for ASIC chip design delivery and providing relevant process/engineering technical support, responsible for the quality, progress, and cost of delivered products.

    1. Responsible for the detailed physical design and verification of ASIC chips from RTL to GDSII, including physical architecture planning, layout and routing, power planning, clock tree synthesis, timing convergence, physical verification, power network analysis, and low-power design. Provide competitive solutions in PPA (performance, power consumption, cost) achievement, design, and process window matching;

    2. Responsible for ASIC chip DFT design and validation, accountable for testing costs, testing coverage, failure rates, and delivery times, providing competitive testing vectors and solutions, carrying out testing diagnostics, assisting in rapid process and testing problem localization.

    Learn more

headquarters address:4-5F, Building 10, Jintai Intelligent Industrial Park, Yubei District, Chongqing

Chengdu Branch:No. 1101, Building 2, Taihe International Financial Center, No. 619 Tianfu Third Street, Wuhou District, Chengdu City, Sichuan Province

Follow us